Suitable for a wide range of thermoplastic polymers, e.g., PP, PA, PET, PLA, etc.
Easy to clean, channels where the melted materials flow smoothly; no need to be disassembled for cleaning. The materials are easier to change.
The temperature of the quenching is adjustable between 15～25℃.
The height of the quenching is adjustable to meet the application needs for the crystallization and cooling of different polymeric materials.
Cantilever structure, easy experimental operation, easy experimental observation.
The type of spinneret aperture is variable.
Thermal bonding device with a unique electrical heating system for more flexible and convenient temperature control.
Thermal bonding system can be equipped with a variety of pressure rolls with different patterns, also suitable for use in the technology of Spun-lace nonwovens.
The combination of the equipment can be configured according to application needs, such as SS, SMS, SSMMS, etc
Change from mono-component to bi-component : only necessary to add the extruder and spinning modules.
Change from bi-component to mono-component : a. interchangeable spinning module ; b. use the same material
Technical Data of Nonwoven Lab Equipment for Mono-component
(Please contact us for bi-component if required)